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Aluminum Heat Sink BGA Aluminum 2.5W Adhesive Backed Specifications Product: Heat Sink Power Dissipation @ Temperature Rise: 2.5W @ 30C Thermal Resistance @ Forced Air Flow: 2.00C/W @ 500 LFM Mounting Style: SMD/SMT Heatsink Material: Aluminum Fin Style: Omnidirectional Fin Length: 27.9 mm (1.1") Width: 27.9 mm (1.1") Height: 15.24 mm (0.598") Designed for: BGA, Super BGA, PBGA, FPBGA, PowerPC Material: Aluminum Material Finish: Black Anodized Color: Black Brand: Wakefield-Vette