830 Point Solderless Breadboard 6.6x2.2 Inch Features Base socket (see figure): twin columns of 5 x 64 terminals are separated by a 0.3" center channel Bus strip (see figure): 4 buses of 25 connected terminals are arranged in 4 rows Specifications Voltage: max. 30 V Current: max. 3 A Material: External body: external body is made of ABS Clips: the internal interconnected clips are made of an alloy of silver and nickel Base socket: 1 Bus strip: 2 Tie points: 830 14-pins IC capacity: 9 Binding post: 0 Dimensions: 6.6" x 2.2" x 0.4" Weight: 3.4oz
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